A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
A Review of Recent Developments in “On-Chip” Embedded Cooling Technologies for Heterogeneous Integrated Applications
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DOI：
10.1016/j.eng.2022.10.019
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发表时间：
2023-04
期刊：
影响因子：
12.8
通讯作者：
S. Rangarajan;Scott N. Schiffres;B. Sammakia
中科院分区：
文献类型：
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作者：
S. Rangarajan;Scott N. Schiffres;B. Sammakia
电子封装界强烈认为，由于最近的技术努力，建立异质集成封装，摩尔定律将继续几年。异构集成（HI）可以在芯片级（具有多个热点的单个芯片）、在多芯片模块中或在垂直堆叠的三维（3D）集成电路中。通量值呈指数级增长，同时芯片尺寸减小，性能显著提高，导致散热增加。电子行业和学术研究界已经研究了各种解决方案，以应对飙升的热管理挑战。嵌入式冷却消除了从芯片到环境的大部分连续传导电阻，这与可分离的冷板/散热器不同。尽管将冷却解决方案嵌入到电子芯片上会产生很高的传热潜力，但技术风险和复杂性仍然与这些技术的实施以及将采用哪些技术的不确定性相关。本文讨论了嵌入式冷却技术的最新进展、流体选择考虑因素以及基于传统、浸没和增材制造的嵌入式冷却技术。
The electronics packaging community strongly believes that Moore’s law will continue for another few years due to recent technological efforts to build heterogeneously integrated packages. Heterogeneous integration (HI) can be at the chip level (a single chip with multiple hotspots), in multi-chip modules, or in vertically stacked three-dimensional (3D) integrated circuits. Flux values have increased exponentially with a simultaneous reduction in chip size and a significant increase in performance, leading to increased heat dissipation. The electronics industry and the academic research community have examined various solutions to tackle skyrocketing thermal-management challenges. Embedded cooling eliminates most sequential conduction resistance from the chip to the ambient, unlike separable cold plates/heat sinks. Although embedding the cooling solution onto an electronic chip results in a high heat transfer potential, technological risks and complexity are still associated with the implementation of these technologies and with uncertainty regarding which technologies will be adopted. This manuscript discusses recent advances in embedded cooling, fluid selection considerations, and conventional, immersion, and additive manufacturing-based embedded cooling technologies.