Oscillation-Speed-Control-Type Polishing with a Small Tool (3rd Report)
Oscillation-Speed-Control-Type Polishing with a Small Tool (3rd Report)
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使用小工具的振荡速度控制型抛光（第三次报告）
DOI：
10.2493/jspe.70.1201
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
M. Mochida
中科院分区：
文献类型：
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作者：
A. Une;K. Yoshitomi;M. Mochida
随着ULSI特征尺寸的不断缩小，小于0.1μm的晶圆平整度变得至关重要，表面形貌中的任何缺陷都会导致器件图案化的严重问题。CMP已经成为平坦化表面形貌的标准技术。研制了一台振动调速型连续磨削抛光机，并对抛光过程进行了模拟。以前的论文表明，正转和反转抛光的实验轮廓与用修正的相对速度方程计算的模拟结果吻合得很好。然而，当工具悬在晶片上很大一部分时，模拟就失败了。本文介绍了测量的压力分布为各种工具悬伸，和一种方法来补偿理论和实验分布之间的差异，并使用补偿产生的抛光量。安全气囊内的气压分布与重物的压力分布有很大的不同，其特性取决于机器。对于大悬伸，压力分布的轮廓变为凹形而不是线性。计算结果与实验结果吻合较好。
As ULSI feature dimensions continue to shrink, wafer flatness of less than 0.1μm has become essential, and any flaws in surface topography cause serious problems in device patterning. CMP has become a standard technology to planarize surface topography. We have developed an oscillation-speed-control-type sequential grinding and polishing machine and have simulated the polishing process. A previous paper showed that experimental profiles polished with normal and reverse rotations agreed well with the simulated result calculated with a modified equation of relative velocity. However, the simulation broke down when the tool overhung the wafer by a significant amount. This paper presents measured pressure distributions for various tool overhangs, and a method to compensate for the difference between theoretical and experimental distributions, and polishing amounts produced using the compensation. The pressure distribution from air pressure in an air-bag is significantly different than that from a weight, and its characteristics depend on the machine. The profile of the pressure distribution for large overhangs becomes concave rather than linear. The simulated results with concave pressure distributions agreed well with experimental results.