Gradient Structured Copper by Rotationally Accelerated Shot Peening
Gradient Structured Copper by Rotationally Accelerated Shot Peening
复制标题
通过旋转加速喷丸形成梯度结构铜
DOI：
10.1016/j.jmst.2016.11.006
复制
发表时间：
2017-07-01
影响因子：
10.9
通讯作者：
Zhu, Y. T.
中科院分区：
文献类型：
--
作者：
Wang, X.;Li, Y. S.;Zhu, Y. T.
发展了一种制备梯度结构材料的新工艺-旋转加速喷丸（RASP）。通过使用离心加速原理和大钢球，RASP技术可以产生比传统喷丸更高的冲击能量。作为概念验证演示，利用RASP来细化纯铜（Cu）的表面层，平均晶粒尺寸为85 nm。晶粒尺寸从表面向下大量增加，形成800 μ m厚的梯度结构表面层，从而形成显微硬度梯度。讨论了RASP技术在制备梯度结构材料方面与其他成熟技术的区别。RASP技术为梯度材料的大规模制造展示了良好的前景。(C)2016由Elsevier Ltd代表Journal of Materials Science & Technology编辑部出版。
A new technology-rotationally accelerated shot peening (RASP), was developed to prepare gradient structured materials. By using centrifugal acceleration principle and large steel balls, the RASP technology can produce much higher impact energy compared to conventional shot peening. As a proof-of-concept demonstration, the RASP was utilized to refine the surface layer in pure copper (Cu) with an average grain size of 85 nm. The grain size increases largely from surface downwards the bulk, forming an 800 mu m thick gradient-structured surface layer and consequently a micro-hardness gradient. The difference between the RASP technology and other established techniques in preparing gradient structured materials is discussed. The RASP technology exhibits a promoting future for large-scale manufacturing of gradient materials. (C) 2016 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.