Material removal mechanisms in grinding of two-phase brittle materials
Material removal mechanisms in grinding of two-phase brittle materials
复制标题
DOI：
10.1007/s00170-017-1184-2
复制
发表时间：
2018-03
期刊：
影响因子：
--
通讯作者：
S. Mueller;Christian Wirtz;D. Trauth;P. Mattfeld;F. Klocke
中科院分区：
文献类型：
--
作者：
S. Mueller;Christian Wirtz;D. Trauth;P. Mattfeld;F. Klocke
单相脆性材料在磨削过程中的材料去除机理在很大程度上得到了理解。相比之下，两相脆性材料的材料去除机制仅仅是已知的初步阻碍了磨削过程中工件表面特性的预测。因此，在这项工作中，两相脆性材料的材料去除机制进行了分析，通过单晶粒切削试验，使用的例子硬质合金和陶瓷基复合材料。在第一步中，在这项工作的框架内调查的材料的结构和性能进行了描述。然后，表面现象演变在单颗粒切削试验确定和表征两种材料。最后，考虑到硬质合金和陶瓷基复合材料的不同结构，提出了描述和解释潜在的材料去除机制的模型。
The material removal mechanisms of one-phase brittle materials during grinding are largely understood. In contrast, the material removal mechanisms of two-phase brittle materials are just known rudimentary hindering the prediction of the workpiece surface characteristics resulting from a grinding process. Hence, in this work, the material removal mechanisms of two-phase brittle materials are analyzed by means of single grain cutting tests using the examples of cemented carbides and ceramic matrix composites. In a first step, the structure and properties of the materials investigated within the frame of this work are described. Then, surface phenomena evolving in single grain cutting tests are identified and characterized for both materials. Finally, models describing and explaining the underlying material removal mechanisms are presented considering the different structure of cemented carbides and ceramic matrix composites.