ULTRAHIGH-VACUUM TECHNIQUES IN MEASUREMENT OF CONTACT ANGLES .3. WATER ON COPPER AND SILVER
ULTRAHIGH-VACUUM TECHNIQUES IN MEASUREMENT OF CONTACT ANGLES .3. WATER ON COPPER AND SILVER
复制标题
DOI：
10.1021/j100594a017
复制
发表时间：
1974-01-01
影响因子：
--
通讯作者：
SCHRADER, ME
中科院分区：
文献类型：
--
作者：
SCHRADER, ME
在压力至少为2X-10Torr的超高真空系统中，通过蒸发沉积了铜和银薄膜。现场测量了无氧水在无氧金属表面的接触角为0。用四极质谱仪进行的残余气体分析表明，暴露在水蒸气中时，氢气和一氧化碳通常会从表面释放出来。这显然是由于水蒸气的吸附取代了之前在完成金属沉积过程中物理吸附的氢和一氧化碳。也有可能氢是通过活性清洁的金属表面还原水分子而产生的。水能够取代以前物理吸附在清洁的铜和银表面上的分子，在这些表面上产生0接触角，并可能与这些表面发生化学反应，所有这些都提供了证据，证明清洁的、无氧的金属表面在性质上是绝对亲水的。
Thin films ofcopper and silver were deposited by evaporation in an ultrahigh vacuum system capable of attaining a pressure of at least 2 X-10 Torr. Contact angles of oxygen-free water on the oxide-free metal surfaces were measured in situ and foundto be 0. Residual gas analysis with a quadrupole mass spectrometer indicated that hydrogen and often carbon monoxide were released from the surfaces upon exposure to water vapor. This apparently resulted from adsorption of water vapor to displace hydrogen and carbon monoxide previously physisorbed during completion of metal deposition. There is also the possibility that hydrogen was produced through reduction of water molecules by the active clean metal surfaces. The ability of water to displace molecules previously physisorbed to the clean copper and silver surfaces, to yield a 0 contact angle on these surfaces, and possibly to reactchemically with the surfaces, all provide evidence that the clean, oxygen-free metal surfaces are decidedly hydrophilic in character.