The effect of electrical charge density on the transition behavior between bonding and clogging stages of an electroplated porous surface
The effect of electrical charge density on the transition behavior between bonding and clogging stages of an electroplated porous surface
复制标题
电荷密度对电镀多孔表面粘合和堵塞阶段之间过渡行为的影响
DOI：
10.1016/j.jmatprotec.2019.03.009
复制
发表时间：
2019-09
影响因子：
6.3
通讯作者：
Tang Yong
中科院分区：
文献类型：
--
作者：
Gao Jiao;Liu Xiaokang;Lu Longsheng;Tang Biao;Tang Yong
与光滑铜板相比，外表面具有多孔层的铜板可以显着增强传热性能。在这项工作中，与传统的粉末烧结技术不同，通过电镀方法制备了由铜粉组成的多孔层。利用扫描电子显微镜（SEM）成像和X射线衍射（XRD）技术分析了该电镀多孔表面的结合机制。通过3D光学轮廓仪和能量色散光谱（EDS）技术研究了制备过程中采用的电荷密度对电镀多孔表面的外观和氧化物相的影响。此外，分别通过推力测试和超声波振动测试总结了电镀多孔表面的结合强度和抗干扰能力。通过水滴铺展和向下吸收测试，讨论了所制备的多孔表面润湿性的变化。凭借最佳的电荷密度，可以将铜粉牢固地构建到基材上并形成互连的多孔层，而不会影响其机械和多孔性能。
A copper plate with a porous layer on its outer surface can significantly enhance heat transfer performance compared with a smooth copper plate. In this work, different from the traditional powder sintering technique, a porous layer consisting of copper powders was prepared by an electroplating method. The bonding mechanism of this electroplated porous surface was analyzed by using scanning electron microscope (SEM) imaging and the X-ray diffraction (XRD) technique. The influences of the electrical charge density adopted in the preparation process on the appearance and oxide phase of the electroplated porous surface were investigated by a 3D optical profiler and energy dispersive spectroscopy (EDS) technique. Moreover, the bonding strength and anti-disturbance ability of the electroplated porous surface were summarized via a thrust test and an ultrasonic vibration test, respectively. Using water droplet spreading and down-absorption tests, the variation of wettability of the prepared porous surface was discussed. With an optimum electrical charge density, it is feasible to securely construct copper powders onto a substrate and form an inter-connective porous layer without compromising its mechanical and porous properties.
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DOI：
10.1016/j.ijheatmasstransfer.2009.10.008
发表时间：
2010-01-15
影响因子：
5.2
作者：
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DOI：
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DOI：
10.1115/imece2011-63530
发表时间：
2015-05
期刊：
--
影响因子：
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作者：
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