Thermal Model and Countermeasures for Future Smart Glasses
Thermal Model and Countermeasures for Future Smart Glasses
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DOI：
10.3390/s20051446
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发表时间：
2020-03-01
期刊：
影响因子：
3.9
通讯作者：
Kurokawa, Atsushi
中科院分区：
文献类型：
--
作者：
Matsuhashi, Kodai;Kanamoto, Toshiki;Kurokawa, Atsushi
智能手表、智能眼镜等可穿戴设备市场持续快速增长。智能眼镜吸引了特别的关注，因为它们提供了方便的功能，如免提增强现实（AR）。由于智能眼镜直接接触面部和头部，高温设备对人体身体健康有不利影响。本文提出了一种稳态条件下的热网络模型和未来智能眼镜热管理的热对策方法。它是通过将佩戴智能眼镜的状态分解为一些部分，为每个部分创建等效热阻电路，将集成电路（IC）等发热部件近似为简单的物理结构，将功耗设置为热源，并提供空气中自然对流的传热系数来完成的。当最高温度为62摄氏度时，热网络模型和商业热求解器之间的平均温差为0.9摄氏度。使用该模型的实验结果表明，通过将热源分布到两侧，可以使耳朵附近直接接触皮肤的部分的温度降低51.4%，通过将发热量较高的部件放置在离耳朵较远的地方，可以使温度降低11.1%，65.3%与所有高导热性材料相比，通过使用用于镜腿和镜腿尖端的低导热性材料和高导热性材料的组合，轮辋。
The market for wearable devices such as smart watches and smart glasses continues to grow rapidly. Smart glasses are attracting particular attention because they offer convenient features such as hands-free augmented reality (AR). Since smart glasses directly touch the face and head, the device with high temperature has a detrimental effect on human physical health. This paper presents a thermal network model in a steady state condition and thermal countermeasure methods for thermal management of future smart glasses. It is accomplished by disassembling the state by wearing smart glasses into some parts, creating the equivalent thermal resistance circuit for each part, approximating heat-generating components such as integrated circuits (ICs) to simple physical structures, setting power consumption to the heat sources, and providing heat transfer coefficients of natural convection in air. The average temperature difference between the thermal network model and a commercial thermal solver is 0.9 degrees C when the maximum temperature is 62 degrees C. Results of an experiment using the model show that the temperature of the part near the ear that directly touches the skin can be reduced by 51.4% by distributing heat sources into both sides, 11.1% by placing higher heat-generating components farther from the ear, and 65.3% in comparison with all high conductivity materials by using a combination of low thermal conductivity materials for temples and temple tips and high conductivity materials for rims.