Manufacturing wearable electronics by direct copper electrodeposition
Manufacturing wearable electronics by direct copper electrodeposition
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DOI：
10.1117/12.2677512
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发表时间：
2023-09
期刊：
影响因子：
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通讯作者：
Nirmita Roy;Nida Khattak;Arash Takshi
中科院分区：
文献类型：
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作者：
Nirmita Roy;Nida Khattak;Arash Takshi
在现代世界，可穿戴电子产品可能会加剧军事、航空航天、医疗、工业和商业行业的转型。然而，直接在织物上制造电子电路或器件是一个重大挑战。在这项研究中，我们通过开发一种两步生产工艺来解决这个问题，即在涤纶织物上涂上木质素。首先，激光烧制木质素后在织物上形成导电模板。在第二步中，使用内部设计的打印机，在导电模板上电镀铜以实现非常低的电阻电路布局。在破坏性测试(如弯曲、滚动、洗涤和附着力测试)之前和之后对电导率测量进行了监测，以证明其具有显著的稳定性和灵活性。通过扫描电子显微镜(SEM)对导电图形的质量进行了检测。此外，应用铜沉积方法将发光二极管(LED)焊接到织物上的应用电路版图上。提出的两步制造方法在制造各种应用的可靠和尖端的可穿戴电子设备方面具有很好的潜力。
In the modern world, wearable electronics are potentially intensifying a transformation of the military, aerospace, medical, industrial, and commercial industries. However, manufacturing electronic circuits or devices directly on fabrics is a major challenge. In this study, we have addressed the issue by developing a two-step manufacturing process by coating a piece of polyester fabric with lignin. Initially, a conductive template was achieved on the fabric after laser-burning lignin. In the second step, using an in-house design printer, copper was electroplated over the conductive template to achieve a very low resistive circuit layout. The conductivity measurements were monitored before and after destructive tests such as bending, rolling, washing, and adhesion tests to prove remarkable stability and flexibility. The quality of the conductive patterns was examined through scanning electron microscopy (SEM). Furthermore, the copper deposition method was applied to solder a light-emitting diode (LED) to the applied circuit layout on the fabric. The proposed two-step manufacturing method has a promising potential to fabricate reliable and leading-edge wearable electronics for various applications.