Micro-mechanical measurements of fracture toughness of bismuth embrittled copper grain boundaries
Micro-mechanical measurements of fracture toughness of bismuth embrittled copper grain boundaries
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DOI：
10.1080/09500839.2011.573813
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发表时间：
2011-01-01
影响因子：
1.2
通讯作者：
Roberts, S. G.
中科院分区：
文献类型：
--
作者：
Armstrong, D. E. J.;Wilkinson, A. J.;Roberts, S. G.
测量单晶界的断裂性能到目前为止需要宏观双晶体，这是昂贵的，并不总是可用的。我们描述了一种方法，用于断裂测试，使用聚焦离子束加工制造，并使用纳米压头。我们已经用这种方法来测量选定的晶界铋脆铜的断裂韧性。该技术适用于其他脆性多晶样品的晶界，对于这些样品，常规测试不能产生大的双晶。
Measuring the fracture properties of single grain boundaries has until now required macroscopic bi-crystals which are expensive and not always available. We describe a method for fracture testing using micro-cantilevers, manufactured using focussed ion beam machining and tested using a nanoindenter. We have used the method to measure the fracture toughness of selected grain boundaries in bismuth-embrittled copper. This technique is applicable to grain boundaries in other brittle polycrystalline samples for which large bi-crystals cannot be produced for conventional testing.