High Entropy Alloys as Filler Metals for Joining.

High Entropy Alloys as Filler Metals for Joining.
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DOI:
10.3390/e23010078
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发表时间:
2021-01-07
期刊:
Entropy (Basel, Switzerland)
影响因子:
--
通讯作者:
Goodall R
Goodall R
中科院分区:
其他
文献类型:
--
作者:
Luo D;Xiao Y;Hardwick L;Snell R;Way M;Sanuy Morell X;Livera F;Ludford N;Panwisawas C;Dong H;Goodall R

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在寻找在高熵合金(HEA)型材料的理念下开发的合金的应用时,重点可以放在当前合金也使用多种组分的应用上,尽管其水平低于HEA中发现的那些。一个这样的领域是用于连接的填充金属,其中已经发现了具有复杂成分的合金。在软钎焊(<450 °C)和硬钎焊(>450 °C)中,填充金属合金被置于其液相线温度以上,并用于在两个部件之间形成金属结合,在整个过程中保持不熔化且基本不变。这些连接方法广泛用于从电子到航空航天和能源的应用中,并且填充金属高度多样化,以允许与广泛的基础材料(包括将陶瓷连接到金属的能力)和大范围的加工温度兼容。在这里,我们回顾了与高熵材料相关的填充金属的最新发展,并认为这种合金值得进一步探索,以帮助克服当前基于填充金属的连接方法需要解决的一些挑战。
In the search for applications for alloys developed under the philosophy of the High Entropy Alloy (HEA)-type materials, the focus may be placed on applications where current alloys also use multiple components, albeit at lower levels than those found in HEAs. One such area, where alloys with complex compositions are already found, is in filler metals used for joining. In soldering (<450 °C) and brazing (>450 °C), filler metal alloys are taken above their liquidus temperature and used to form a metallic bond between two components, which remain both unmelted and largely unchanged throughout the process. These joining methods are widely used in applications from electronics to aerospace and energy, and filler metals are highly diverse, to allow compatibility with a broad range of base materials (including the capability to join ceramics to metals) and a large range of processing temperatures. Here, we review recent developments in filler metals relevant to High Entropy materials, and argue that such alloys merit further exploration to help overcome a number of current challenges that need to be solved for filler metal-based joining methods.
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