Residues in printed wiring boards and assemblies
Residues in printed wiring boards and assemblies
复制标题
印刷线路板和组件中的残留物
DOI：
10.1108/03056120110360291
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发表时间：
2001
期刊：
影响因子：
0.9
通讯作者：
D. Pauls
中科院分区：
文献类型：
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作者：
D. Pauls
本文是对印刷配线板和印刷配线组件上残留物的检查。说明了残留物的来源，并讨论了各种残留物的影响。介绍了裸板清洁度问题的案例研究，水溶性助焊剂和水性清洁工艺，以及低固体助焊剂（无清洁）工艺，有和没有清洁。案例研究反映了在各种过程故障排除工作中获得的经验教训。采用先进的离子色谱法对本文中的残留物进行了表征。此外，还给出了一些表面绝缘电阻（SIR）的数据。
This paper is an examination of residues on printed wiring boards and printed wiring assemblies. Sources of residues are illustrated and the effects of various residues are discussed. Case studies are presented for bare board cleanliness issues, water soluble flux and aqueous cleaning processes, and low solids flux (no‐clean) processes, with and without cleaning. The case studies reflect lessons learned in various process troubleshooting efforts. Residues in this paper were characterized using advanced ion chromatography procedures. In addition, some data on surface insulation resistance (SIR) are presented.