Delta-L methodology for efficient PCB trace loss characterization

Delta-L methodology for efficient PCB trace loss characterization
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用于高效 PCB 走线损耗表征的 Delta-L 方法

DOI:
10.1109/impact.2014.7048423
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发表时间:
2014
期刊:
2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
影响因子:
--
通讯作者:
Y. L. Li
Y. L. Li
中科院分区:
--
文献类型:
--
作者:
J. Hsu;T. Su;Kai Xiao;X. Ye;Shih;Y. L. Li

文献摘要

被引文献

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通孔效应对整个通道的损耗有很大的影响。无通孔影响的带状线设计的损耗特性对于设计者评估介质材料选择和制造工艺控制是非常重要的。本文提出了一种有效的方法,即Delta-L,有效地消除通孔效应,准确地表征电路板的电气性能。
The via effect has a big impact to the loss of the entire channel. To characterize the loss of a stripline design without the via contribution is very important for a designer to evaluate the dielectric material selection and the manufacturing process control. In this paper, an effective methodology, namely Delta-L, was proposed to remove the via effect efficiently and characterize the board electrical performance accurately.