Fatigue-Induced Damage and Crack Growth of Cu Processed by ECAP
Fatigue-Induced Damage and Crack Growth of Cu Processed by ECAP
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ECAP 加工铜的疲劳损伤和裂纹扩展
DOI：
10.1142/s021798491540028x
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发表时间：
2015
影响因子：
1.9
通讯作者：
Sangshik Kim
中科院分区：
文献类型：
--
作者：
Masahiro Goto;Seung Zeon Han;Kakeru Morita;Jee-Hyuk Ahn;Jyunichi Kitamura;Masataka Baba;Sangshik Kim
研究了等通道转角挤压（ECAP）工艺对超细晶铜疲劳损伤和裂纹扩展行为的影响。在高应力下，疲劳裂纹在沿最终ECAP剪切面沿着形成的剪切带（SB）处萌生。在低应力下，由于动态再结晶，晶粒发生粗化。然后在这些晶粒内部形成滑移带，并随后作为裂纹的起始点。裂纹扩展的方向，无论是45°或垂直于加载轴，根据应力而变化。根据表面损伤的显微观察，探讨了疲劳裂纹的形成和扩展机理。
The fatigue-induced damage and crack growth behavior were studied on the ultrafine grained copper processed by equal channel angular pressing (ECAP). At high stresses, fatigue cracks were initiated at the shear bands (SBs) formed along the shear plane of the final ECAP. At low stresses, the grain coarsening occurred due to dynamic recrystallization. The slip bands were then formed inside these grains and subsequently served as an initiation sites for cracks. The direction of crack growth, either 45° or perpendicular to the loading axis, varied depending on the stress. The formation and growth mechanisms of fatigue crack are discussed based on the micrographic observation of surface damage.