Hot Stamping of Electric Circuits by 3D Printer

Hot Stamping of Electric Circuits by 3D Printer
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通过 3D 打印机热冲压电路

DOI:
10.1145/3332167.3356895
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发表时间:
2019
期刊:
Adjunct Proceedings of the 32nd Annual ACM Symposium on User Interface Software and Technology
影响因子:
--
通讯作者:
Hiroyuki Manabe
Hiroyuki Manabe
中科院分区:
--
文献类型:
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作者:
Yuhei Imai;Kunihiro Kato;N. Segawa;Hiroyuki Manabe

文献摘要

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制造现代电路涉及许多过程、技能和努力。制造原型的一个挑战是制作电路的难度。我们提出了一种制造技术,允许用户轻松地构建电路。它基于热冲压技术,但使用单个挤出机3D打印机而不是模具。电路由金属箔制成,可以沉积在各种表面上,包括纸张和丙烯酸板。测试证实,该技术可以制造电路,其上可以通过焊接实现电子器件。
Making modern electric circuits involves a lot of processes, skills, and effort. One challenge in fabricating prototypes is the difficulty of making electric circuits. We propose a fabrication technique that allows users to easily build electric circuits. It is based on a hot stamping technique but uses a single extruder 3D printer instead of dies. The circuits are made of metal foil and can be deposited on various surfaces including paper and acrylic board. Tests confirm that the technique can fabricate circuits on which electronic devices can be implemented by soldering.