SPH-based Flow Simulation of Polishing Slurry Including Polished Debris in CMP
SPH-based Flow Simulation of Polishing Slurry Including Polished Debris in CMP
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DOI：
10.2493/jjspe.73.90
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发表时间：
2007
影响因子：
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通讯作者：
K. Takano;Koichiro Yamada;N. Takezawa;Tatsutoshi Suzuki;T. Inamura
中科院分区：
文献类型：
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作者：
K. Takano;Koichiro Yamada;N. Takezawa;Tatsutoshi Suzuki;T. Inamura
