THERMAL CONDUCTIVITY ENHANCEMENT OF POLYMERS VIA STRUCTURE TAILORING
THERMAL CONDUCTIVITY ENHANCEMENT OF POLYMERS VIA STRUCTURE TAILORING
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DOI:
10.1615/jenhheattransf.2020034592
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发表时间:
2020
影响因子:
2.3
通讯作者:
Shen Xu;Jing Liu;Xinwei Wang
中科院分区:
文献类型:
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作者:
Shen Xu;Jing Liu;Xinwei Wang
Shen Xu a, , Jing Liu , and Xinwei Wang c a School of Mechanical and Automotive Engineering, Shanghai University of Engineering Science, Shanghai 201620, P.R. China b College of New Materials and New Energies, Shenzhen Technology University, Shenzhen 518118, P.R. China c Department of Mechanical Engineering, Iowa State University, Ames, Iowa 50011, USA Abstract Polymers are usually known for its low thermal conductivity. However, high thermal conductive polymers are in growing demand in industry nowadays for their low density, low cost, flexibility, and good environmental resistance compared with conventional substances of high thermal conductivity. Composites filled with high thermal conductivity nanofillers will increase the thermal conductivity (k) but it is clearly noticed that the mechanical properties will deteriorate along with this process. Instead, increasing the intrinsic thermal conductivity of polymers themselves is more important. This review focuses on the mechanism of increasing k from perspectives of polymer intrinsic structure tailoring: crystallinity, orientation of crystallites, crystalline grain size, and the alignment of molecular chain in amorphous region. Structure tailoring methods of increasing/improving those four factors are critically reviewed and discussed. Accurate thermal characterization methods are critically reviewed for those structure-tailored polymers in low dimensions. The transient electro-thermal (TET) and pulsed laser-assisted thermal