Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser
Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser
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DOI：
10.3390/polym10121390
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发表时间：
2018-12-01
期刊：
影响因子：
5
通讯作者：
Wang, Lingzhi
中科院分区：
文献类型：
--
作者：
Zhao, Wanqin;Wang, Lingzhi
高密度、高质量的互连是制备微型化、轻量化电子产品的必要条件。因此，需要fpc（柔性印刷电路）中的小直径和高密度通孔。然而，现有的加工方法不能进一步减小通孔直径，提高通孔质量。相比之下，超短脉冲激光是一个很好的选择。本文系统地研究了利用10ps脉冲激光在fpc上微钻通孔的工艺。研究了波长、能量、脉冲和偏振等激光参数对通孔钻孔的影响。对各种工艺参数进行了优化，并讨论了合理的原因。最后，获得了理想的小直径高密度fpc通孔。实验结果表明，利用超短脉冲激光可以成功地在fpc中钻取直径小于10 μ m、进口互连间距为02 μ m的通孔。
High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decrease the diameters and improve the quality of through-holes. Comparatively, ultrashort pulse laser is a good choice. In this paper, the processing technology for the microdrilling of through-holes in FPCs using a 10 ps pulse laser was systematically studied. The effects of laser parameters, including the wavelength, energy, pulses and polarization, on the drilling of through-holes were investigated. The various processing parameters were optimized and the plausible reasons were discussed. Finally, the desired small-diameter and high-density through-holes in FPCs were obtained. The experimental results showed that, through-holes with diameters of less than 10 mu m and inlet interconnection pitches of 02 mu m could be successfully drilled in FPCs using ultrashort pulse laser.