Automated insertion of package dies onto wire and into a textile yarn sheath
Automated insertion of package dies onto wire and into a textile yarn sheath
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DOI:
10.1007/s00542-019-04361-y
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发表时间:
2022-06-01
影响因子:
2.1
通讯作者:
Dias, Tilak
中科院分区:
文献类型:
--
作者:
Hardy, Dorothy Anne;Anastasopoulos, Ioannis;Dias, Tilak
Wider adoption of electronic textiles requires integration of small electronic components into textile fabrics, without comprising the textile qualities. A solution is to create a flexible yarn that incorporates electronic components within the fibres of the yarn (E-yarn). The production of these novel E-yarns was initially a craft skill, with the inclusion of package dies within the fibres of the yarn taking about 90 min. The research described here demonstrated that it is possible to produce E-yarns on an industrial scale by automating the manufacturing process. This involved adapting printed circuit board manufacturing technology and textile yarn covering machinery. The production process started with re-flow soldering of package dies onto fine multi-strand copper wire. A carrier yarn was then placed in parallel with the copper wire to provide tensile strength. The package die and adjacent carrier yarn were then encapsulated in a polymer micro-pod to provide protection from moisture ingress and from mechanical strain on the die and solder joints. The process was then completed by surrounding the micro-pod and copper interconnects with additional fibres, held tightly together with a knitted fibre-sheath. This prototype, automated production process reduced the time for embedding one micro-device within a yarn to 6 min, thus increasing the production speed, demonstrating that automation of the E-yarn production process is feasible. Prototype garments have been created using E- yarns. Further developments can include automated transfer of the yarn components from one stage of production to the next, enabling greater increases in speed of manufacture of E yarns.