Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds
Fabrication of flexible copper patterns by electroless plating with copper nanoparticles as seeds
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DOI：
10.1016/j.apsusc.2021.149220
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发表时间：
2021-05
影响因子：
6.7
通讯作者：
Yabing Zhang;Teng Zhang;Hongbing Shi;Qing Liu;Tao Wang
中科院分区：
文献类型：
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作者：
Yabing Zhang;Teng Zhang;Hongbing Shi;Qing Liu;Tao Wang
采用喷墨打印技术，结合纳米铜导电油墨和化学镀铜技术，在室温下成功地在热敏性聚对苯二甲酸乙二酯（PET）基底上制备了低电阻、附着力好、稳定性高的柔性导电铜图案。Cu纳米粒子作为催化剂促进铜离子在PET表面的化学沉积。采用二甲基氨基硼烷（DMAB）作为还原剂，在化学镀过程中去除有毒的甲醛。铜图案与3-巯基丙基三乙氧基硅烷（MPTES）改性的PET基材具有很强的附着力，即使经过4000次弯曲试验也不会脱落。图形的电阻率可低至5.43 μΩ·cm，约为体铜电阻率的3倍。图形的方块电阻最小值为54 mΩ/sq，在大气中放置5个月后变化不大，显示图形具有良好的抗氧化性能。
Flexible conductive copper patterns with low electric resistance, good adhesion, and high stability were successfully prepared on heat-sensitive polyethylene terephthalate (PET) substrate by combining the inkjet print with copper nanoparticles (Cu NPs) conductive ink and electroless plating (ELP) copper at room temperature. The Cu NPs served as the catalysts to promote copper ions electroless deposition on PET surface. Dimethylaminoborane (DMAB) was used as the reductant to place poisonous formaldehyde in the electroless plating process. The Cu patterns had a strong adhesion with PET substrate modified by 3-Mercaptopropyltriethoxysilane (MPTES) and would not fall even after 4000 cycles bending test. The electric resistivity of patterns could be as low as 5.43 μΩ·cm, which is about three times that of bulk copper. The minimum sheet resistance of the patterns was 54 mΩ/sq and had little change in the atmosphere for five months, that showed the patterns had an excellent anti-oxidation performance.