Determination of mechanical properties of copper at the micron scale
Determination of mechanical properties of copper at the micron scale
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DOI：
10.1002/adem.200600129
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发表时间：
2006-11-01
影响因子：
3.6
通讯作者：
Dehm, Gerhard
中科院分区：
文献类型：
--
作者：
Kiener, Daniel;Motz, Christian;Dehm, Gerhard
Using a focused ion beam workstation, micron‐sized bending and compression samples were fabricated from a pure copper single crystal. The bending and compression experiments exhibited a strong size effect on the flow stress of copper, reaching values in the order of 1 GPa for the smallest test structures. Conventional strain gradient plasticity approaches are not capable of explaining this behaviour. The surface damage introduced by Ga+ion implantation during focused ion beam preparation was investigated using Auger electron spectroscopy and its consequence on the mechanical response of the miniaturized test samples is addressed.
