Double patterning lithography: double the trouble or double the fun?
Double patterning lithography: double the trouble or double the fun?
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双图案光刻：双倍麻烦还是双倍乐趣？
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发表时间：
2009
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通讯作者：
P. Zimmerman
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作者：
P. Zimmerman
下一代光刻技术（NGL）的准备延迟建议使用现有方法来实现32和22nm半间距节点的关键技术生产。为了实现这一点，某些版本的双重图案（DP）技术将需要与现有技术相结合。其中最明显的是193nm浸没（193i）光刻技术。虽然综合方法的拥有成本是一个问题，但在目前的状态下，任何NGL的巨大机会成本使得DP光刻（DPL）成为可预见的未来的明确选择。目前尚不清楚的是，究竟哪种方法或方法组合能够为22nm及以后的节点提供最佳分辨率和最佳经济效益。尽管缺乏明确的方法选择，DPL已经证明了它是光刻技术通往22nm节点的桥梁，1在使用极紫外光刻技术生产类似规模的SRAM之前，用0.1 μm2生产了一个六晶体管静态随机存取存储器（SRAM）单元尽管如此，DP对平版印刷来说还是一个相对较新的人，它是由必要性而不是任何接受这种方法的愿望带来的。对于光刻界来说，DP是双倍的麻烦，因为它背后没有新的突破性技术。光刻技术的另一种波长可能还需要十年的时间才能被引入制造业，而且目前还没有其他基于光刻技术的颠覆性技术。然而，对于世界各地的工艺工程师来说，由于技术提供的新机会，DP的乐趣加倍。它有如此多的新颖品种（每种都有自己的加工相关挑战），以至于各地的工艺工程师都在庆祝，从而使DP在光刻社区中重新流行起来。图1所示。双图版光刻的两种方法示意图。光刻冷冻工艺是光刻、光刻（LELE）方法的后续发展。Si：硅衬底。
Delays in readiness of next generation lithography (NGL) suggest the use of existing methods to enable the production of key technologies at the 32 and 22nm half-pitch nodes. In order to achieve this, some version of double patterning (DP) technology will need to be combined with established techniques. The most obvious of these is 193nm immersion (193i) lithography. Although the cost of ownership of a combined method is an issue, the huge opportunity costs of any NGL in its current state make DP lithography (DPL) the clear choice for the foreseeable future. What is unclear is the exact approach or combination of approaches that will provide the best resolution and the best economics for the 22nm node and beyond. Despite the lack of an obvious choice of methodology, DPL has already shown that it is lithography’s bridge to the 22nm node,1 producing a sixtransistor static random access memory (SRAM) cell under 0.1 μm2 nearly six months before a similarly scaled SRAM was produced using extreme ultraviolet lithography.2 Still, DP is a relative newcomer to lithography, brought on by necessity rather than any desire to embrace the methodology. For the lithography community, DP is double the trouble because there is no new breakthrough technology behind it. An alternative wavelength for photolithography is perhaps a decade away from being introduced into manufacturing, and no other lithography-based disruptive technologies are on the horizon. For process engineers around the world, however, DP is double the fun because of the new opportunities the technology offers. It comes in so many novel varieties (each with its own processing-related challenges) that process engineers everywhere are celebrating resulting in a new found popularity for DP within the lithography community. Figure 1. Schematic of two approaches to double patterning lithography. The litho-freeze process was developed subsequently to the lithoetch, litho-etch (LELE) approach. Si: silicon substrate.