Mechanical fatigue on gold MEMS devices: Experimental results
Mechanical fatigue on gold MEMS devices: Experimental results
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金 MEMS 器件的机械疲劳：实验结果
DOI：
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发表时间：
2008
期刊：
影响因子：
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通讯作者：
A. Ballestra
中科院分区：
文献类型：
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作者：
G. Pasquale;A. Somà;A. Ballestra
研究了机械疲劳对金器件结构性能的影响。在周期性负载应用期间，监测特殊测试微系统的吸合电压。机械塌陷被认为是试样机械强度的急剧损失。疲劳极限的估算是通过检测吸合电压的阶梯法进行的。通过光学干涉技术进行测量。
The effect of mechanical fatigue on structural performances of gold devices is investigated. The pull-in voltage of special testing micro-systems is monitored during the cyclical load application. The mechanical collapse is identified as a dramatic loss of mechanical strength of the specimen. The fatigue limit is estimated through the stair-case method by means of the pull-in voltage detections. Measurements are performed by means of the optical interferometric technique.