Effect of interfacial reaction on the thermal conductivity of Al-SiC composites with SiC dispersions

Effect of interfacial reaction on the thermal conductivity of Al-SiC composites with SiC dispersions
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DOI:
10.1111/j.1151-2916.2001.tb00764.x
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发表时间:
2001-04-01
影响因子:
3.9
通讯作者:
Kawai, C
Kawai, C
中科院分区:
材料科学2区
文献类型:
--
作者:
Kawai, C

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采用X射线衍射和透射电镜(TEM)研究了Al/SiC界面反应对SiC颗粒弥散Al基复合材料热导率的影响,并采用热导率混合律定量计算了Al-SiC复合材料界面的热导率h(c)。采用成分为Al(纯Al或Al-11体积% Si合金)-66,3体积% SiC和各种SiC颗粒尺寸的Al-SiC复合材料作为试样,在Al基体中添加Si增加了隔热层电导率,尽管它降低了整体热导率。X射线衍射分析表明,在某些试样中,除了Al和SiC外,还形成了Al 4C 3和Si作为副产物。TEM观察表明,在SiC颗粒与Al基体界面处生成了晶须状产物,可能是Al_4C_3。随着Al_4C_3含量的增加,Al-SiC复合材料的热导率和热导率降低。
The effect of interfacial reactions between Al and SiC on the thermal conductivity of SiC-particle-dispersed Al-matrix composites was investigated by X-ray diffraction and transmission electron microscopy (TEM), and the thermal barrier conductance (h(c)) of the interface in the Al-SiC composites was quantified using a rule of mixture regarding thermal conductivity. Al-SiC composites with a composition of Al (pure Al or Al-11 vol% Si alloy)-66,3 vol% SiC and a variety of SiC particle sizes were used as specimens, The addition of Si to an Al matrix increased the thermal barrier conductance although it decreased overall thermal conductivity. X-ray diffraction showed the formation of Al4C3 and Si as byproducts in addition to Al and SiC in some specimens. TEM observation indicated that whiskerlike products, possibly Al4C3, were formed at the interface between the SiC particles and the Al matrix, The thermal barrier conductance and the thermal conductivity of the Al-SiC composites decreased with increasing Al4C3 content, The role of Si addition to an Al matrix was concluded to be restraining an excessive progress of the interfacial reaction between Al and SiC.