Stabilized platinum electrodes for ferroelectric film deposition using Ti, Ta and Zr adhesion layers
Stabilized platinum electrodes for ferroelectric film deposition using Ti, Ta and Zr adhesion layers
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DOI：
10.1143/jjap.37.2007
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发表时间：
1998-04-01
期刊：
影响因子：
--
通讯作者：
Muralt, P
中科院分区：
文献类型：
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作者：
Maeder, T;Sagalowicz, L;Muralt, P
使用不同粘附层的Pt基金属化（Ti. Zr和Ta）用作氧化硅衬底上的铁电薄膜的电极。比较了在铁电薄膜生长之前氧化粘附层的不同方法。在获得稳定方面。良好定义的（111）取向的粘附性Pt膜，同时避免铅通过电极扩散。在原位沉积PbTiO_3时，高过量铅助熔剂。发现通过Pt膜的铅扩散强烈地依赖于粘附层和稳定化处理。预氧化减少了后续处理期间的铅扩散，Ti在氧化时扩散通过电极。而Ta和Zr保持成块，类似于相应氧化物中的扩散率。开发了一种新的氧化处理，以产生稳定的。具有受控取向和对铅扩散的良好阻挡性能的粘附金属化。
Pt-based metallizations using different adhesion layers (Ti. Zr and Ta) were studied for use as electrodes for Ferroelectric thin films on oxidized silicon substrates. Different ways of oxidizing the adhesion layers prior to ferroelectric film growth are compared. with regard to obtaining stable. adherent Pt films of well-defined (111) orientation, while avoiding lead diffusion through the electrode. Upon in-situ deposition of PbTiO3 nt high excess lead flux. lead diffusion through the Pt film was found to depend strongly on the adhesion layer and the stabilization treatment. Pre-oxidation reduces leed diffusion during the later processing Ti diffuses through the electrode upon oxidation. whereas Ta and Zr stay in piece, in analogy to the diffusivities in the corresponding oxides. A novel oxidation treatment was developed to produce stable. adherent metallizations with controlled orientation and good barrier properties against lead diffusion.