An experimental and modeling investigation of tensile creep resistance of a stable nanocrystalline alloy
An experimental and modeling investigation of tensile creep resistance of a stable nanocrystalline alloy
复制标题
稳定纳米晶合金拉伸蠕变抗力的实验和建模研究
DOI:
10.1016/j.actamat.2020.08.020
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发表时间:
2020
期刊:
影响因子:
9.4
通讯作者:
Solanki, K.N.
中科院分区:
文献类型:
--
作者:
Kale, C.;Srinivasan, S.;Hornbuckle, B.C.;Koju, R.K.;Darling, K.;Mishin, Y.;Solanki, K.N.
Nanocrystalline (NC) materials possess excellent room temperature properties, such as high strength, wear resistance, and toughness as compared to their coarse-grained counterparts. However, due to the excess free energy, NC microstructures are unstable at higher temperatures. Significant grain growth is observed already at moderately low temperatures, limiting the broader applicability of NC materials. Here, we present a design approach that leads to a significant improvement in the high temperature tensile creep resistance (up to 0.64 of the melting temperature) of a NC Cu-Ta alloy. The design approach involves alloying of pure elements to create a distribution of nanometer sized solute clusters within the grains and along the grain boundaries. We demonstrate that the addition of Ta nanoclusters inhibits the migration of grain boundaries at high temperatures and reduces the dislocation motion. This leads to a highly unusual tensile creep behavior, including the absence of any appreciable steady-state creep deformation normally observed in almost all materials. This design strategy can be readily scaled-up for bulk manufacturing of creep-resistant NC parts and transferred to other multicomponent systems such as Ni-based alloys.