Effect of electric current on fracture and constitutive behavior of SN-Ag-Cu solder joints
Effect of electric current on fracture and constitutive behavior of SN-Ag-Cu solder joints
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DOI：
10.1016/j.engfracmech.2016.12.015
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发表时间：
2017-02
影响因子：
5.4
通讯作者：
Yao Yao-Yao;R. An;X. Long
中科院分区：
文献类型：
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作者：
Yao Yao-Yao;R. An;X. Long
研究了电流密度对96.5SN-3.0Ag-0.5Cu （wt.%）焊点拉伸断裂性能的影响。实验结果表明，由于电迁移引起的电流对材料的力学性能影响很大。试验得到的应力-应变曲线揭示了材料的延性、塑性和断裂应变的变化规律。基于弹塑性和损伤机理，建立了以塑性应变、损伤阈值和非弹性耗散为变量的统一蠕变-塑性-损伤本构模型。通过实验和数值分析，确定了损伤参数与电流时间的关系。总的来说，所提出的模型能够以合理的精度预测焊料在电流密度下的力学行为。
The effect of electric current density on the tensile fracture property of 96.5SN-3.0Ag-0.5Cu (in wt.%) solder joints was studied. Experimental results indicate that the mechanical property was profoundly affected by the electric current due to electromigration. The variation of ductility, plasticity and rupture strain was revealed by the stress-strain curves obtained from experimental studies. Based on the mechanism of elastic-plasticity and damage, a unified creep-plastic-damage constitutive model with variables of plastic strain, damage threshold and inelastic dissipation was developed. The relationship of damage parameters and electric current time has been determined from experimental and numerical analysis. In general, the proposed model can predict mechanical behaviors of solder under current density with reasonable accuracy.