Nanoporous Copper Pattern Fabricated by Electron Beam Irradiation on Cu3N Film for SERS Application
Nanoporous Copper Pattern Fabricated by Electron Beam Irradiation on Cu3N Film for SERS Application
复制标题
通过电子束辐照在 Cu3N 薄膜上制备纳米多孔铜图案用于 SERS 应用
DOI：
10.1002/pssb.201800378
复制
发表时间：
2019-02-01
影响因子：
1.6
通讯作者：
Schmidt, Oliver G.
中科院分区：
文献类型：
--
作者：
Du, Yun;Yin, Yin;Schmidt, Oliver G.
铜纳米结构由于其在电子学、催化和光子学等领域的广泛应用而引起了人们的广泛研究兴趣。本文报道了一种利用电子束照射氮化铜薄膜制备铜纳米多孔结构的新方法。这种基于电子束的直接写入方法提供了对基板上的纳米多孔位点的精确控制。实验结果表明，由于局部表面等离子体共振支持在纳米孔的铜多孔纳米结构相比，平坦的氮化铜薄膜显着的表面增强拉曼散射（Sers）。这项工作提供了一个无掩模的方法来制备铜纳米多孔结构的氮化铜薄膜，并意味着一个有效的Sers平台，敏感的分子诊断。
Copper nanostructures have aroused extensive research interests due to their wide applications in electronics, catalysis, and photonics. Here, a novel strategy to fabricate copper nanoporous structures by illuminating electron beam on as-prepared copper nitride thin films is reported. This electron beam-based direct writing method provides a precise control of the nanoporous sites on substrates. Experimental results reveal significant surface-enhanced Raman scattering (SERS) for copper porous nanostructures compared with flat copper nitride thin films due to localized surface plasmon resonances supported at the nanopores. This work provides a maskless method to prepare copper nanoporous structures from copper nitride films and implies an efficient SERS platform for sensitive molecular diagnostics.