For Mechanical Engineers
For Mechanical Engineers
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对于机械工程师
DOI：
10.13182/nt65-a20516
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发表时间：
1965
影响因子：
1.5
通讯作者：
T. V. Sheehan
中科院分区：
文献类型：
--
作者：
T. V. Sheehan
ASM Pacific Technology Limited（“ASMPT”）（HKG：0522）作为全球技术和市场的领导者，为半导体组装和封装行业开发和提供领先的解决方案和材料，以及为广泛的终端用户市场提供表面贴装技术解决方案，包括电子、移动的通信、汽车、工业、LED和太阳能。ASMPT在研发方面不断创新，为客户提供创新和具有成本效益的解决方案和系统，帮助他们实现更高的生产力，更高的可靠性和更高的质量。
Profile of ASM Pacific Technology Ltd. (ASMPT) ASM Pacific Technology Limited ("ASMPT") (HKG: 0522), as a global technology and market leader, develops and provides leading edge solutions and materials for semiconductor assembly and packaging industries, as well as surface mount technology solutions in a wide range of end-user markets including electronics, mobile communications, automotive, industrial, LED and solar energy. ASMPT consistently invents in R&D to provide customers with innovative and cost-efficient solutions and systems that help them to achieve higher productivity, greater reliability and enhanced quality.