Micron-Bubble Formation on Polycrystal Tungsten due to Low-Energy and High-Flux Helium Plasma Exposure
Micron-Bubble Formation on Polycrystal Tungsten due to Low-Energy and High-Flux Helium Plasma Exposure
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DOI：
10.2320/matertrans.46.561
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发表时间：
2005-03
影响因子：
1.2
通讯作者：
D. Nishijima;M. Miyamoto;H. Iwakiri;M. Ye;N. Ohno;K. Tokunaga;N. Yoshida;S. Takamura
中科院分区：
文献类型：
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作者：
D. Nishijima;M. Miyamoto;H. Iwakiri;M. Ye;N. Ohno;K. Tokunaga;N. Yoshida;S. Takamura
研究了低能高通量氦等离子体对多晶钨的表面改性。在2200K的表面温度下，即使在氦的入射离子能量为10 eV的情况下，表面也会形成微米级的孔洞和气泡。当氦的入射离子能量在5 eV左右时，表面空穴的形成明显减少，而在低于5 eV的离子能量下，表面没有发生任何修饰。在W样品的横截面上观察到微米级氦气泡的聚结。
Surface modification of polycrystal tungsten due to low-energy and high-flux helium plasma exposure was investigated. Micron-sized holes and bubbles were formed on the surface at a surface temperature of 2200 K even when the incident ion energy of helium was 10 eV. Hole formation was significantly reduced on the surface when the incident ion energy of helium was around 5 eV and no surface modification was seen at less than 5 eV. Coalescence of micron-sized helium bubbles was observed in the cross section of a W sample.