Forming Behavior during Joining by Laser Induced Shock Waves
Forming Behavior during Joining by Laser Induced Shock Waves
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DOI：
10.4028/www.scientific.net/kem.651-653.1451
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发表时间：
2015-07
期刊：
影响因子：
--
通讯作者：
S. Veenaas;F. Vollertsen
中科院分区：
文献类型：
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作者：
S. Veenaas;F. Vollertsen
不断发展的小型化趋势使得混合接头也适用于微型范围。由于加入原理的原因，现有的解决方案往往存在限制。因此，BIAS 采用了一种新的连接技术，该技术是通过基于 TEA-CO2 激光诱导冲击波的塑性成型工艺实现的。该技术可以连接厚度在 20 µm 至 300 µm 之间的不同板材。接头的制造是一个增量过程，需要多次激光诱导冲击波来形成底切，从而呈现出接头本身。为了分析该工艺的增量成形行为，将 50 µm 厚的铝 (Al99.5) 成形板与 100 µm 厚的不锈钢 (1.4301) 模具板连接在一起。前十个激光脉冲会导致相对较高的感应应变，而为了形成底切，需要 200 个激光脉冲。每个激光脉冲的增量感应应变随着所使用的激光脉冲的数量呈指数下降。这种行为可以通过感应冲击波和接触面积的作用压力分布来解释。
The ongoing trend of miniaturization makes hybrid joint also for the micro range necessary. Existing solutions often have restrictions due to the principle of joining. Therefore a new joining technology, which is realized by a plastic forming process based on TEA-CO2-laser induced shock waves, is used at BIAS. This technology enables the joining of different sheet materials with thicknesses between 20 µm and 300 µm. The manufacturing of the joint is an incremental process where several laser induced shock waves are needed to form the undercut, which presents the joint itself. For the analysis of the incremental forming behavior of this process a 50 µm thick forming sheet of aluminum (Al99.5) is joined with a 100 µm thick stainless steel (1.4301) die sheet. The first ten laser pulses are leading to relative high induced strain while for forming of the undercut 200 laser pulses are needed. The incremental induced strain per laser pulse decreases exponentially with the amount of used laser pulses. This behavior is explained by the acting pressure distribution of the induced shock wave and the contact area.