Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
复制标题
助熔剂对倒装芯片应用的非流动底部填充材料性能影响的研究
DOI：
10.1109/ectc.1998.678680
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发表时间：
1998
期刊：
影响因子：
--
通讯作者：
C. Wong
中科院分区：
文献类型：
--
作者：
S. Shi;C. Wong
作为倒装芯片应用的无流动底部填充工艺的关键要求之一，必须在所开发的无流动助焊剂材料中加入适当的自助焊剂，以在同时的焊料回流和助焊剂材料固化期间提供适当的助焊活性。然而，大多数助熔剂对非流动性涂层材料的性能和组件的可靠性有一些不利的影响。在本文中，我们已经广泛地调查了所选择的助焊剂的浓度对材料性能、互连完整性和组装可靠性的影响。通过这项工作，获得了助熔剂的最佳浓度窗口，并建立了评价助熔剂的常规程序。
As one of the key requirements of the no-flow underfilling process for flip-chip applications, a proper self-fluxing agent must be incorporated in the developed no-flow underfill materials to provide proper fluxing activity during the simultaneous solder reflow and underfill material curing. However, most fluxing agents have some adverse effects on the no-flow underfill material properties and assembly reliability. In this paper, we have extensively investigated the effect of the concentration of the selected fluxing agent on the material properties, interconnect integrity and assembly reliability. Through this work, an optimum concentration window of the fluxing agent is obtained and a routine procedure of evaluating fluxing agents is established.