Modelling and investigation of the silicon twin design 3D micro probe

Modelling and investigation of the silicon twin design 3D micro probe
复制标题

DOI:
10.1088/0960-1317/15/3/011
复制
发表时间:
2005-03-01
影响因子:
2.3
通讯作者:
Brand, U
Brand, U
中科院分区:
工程技术4区
文献类型:
--
作者:
Nesterov, V;Brand, U

文献摘要

被引文献

相似文献

The 3D micro probe is based on a silicon boss-membrane with piezo-resistive transducers, which enable the measurement of the deflections of the probing pin and, simultaneously, the forces in all three dimensions. The development of a 3D silicon boss-membrane micro probe poses the problem of different stiffnesses in the Z- and X-, Y-directions. In general the ratio of these stiffnesses is approximately 30. A novel design (the so-called twin design) makes the achievement of equal stiffness possible in the three orthogonal probing directions of the 3D micro probe. The twin design is based on two parallel single silicon boss-membranes attached to each other. An analytical model for the calculation of the mechanical properties of the twin design is submitted. The developed analytical model describes the deformations of the membranes if the probe pin is deflected, and also the nonlinear mechanical properties of the twin design 3D micro probe. A comparison and an analysis of the experimental and theoretical results of the twin design investigation were carried out.