Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics
Application of Boiling Heat Transfer to High-Heat-Flux Cooling Technology in Power Electronics
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DOI：
10.5104/jiepeng.4.127
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
Koichi Suzuki;K. Yuki;M. Mochizuki
中科院分区：
文献类型：
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作者：
Koichi Suzuki;K. Yuki;M. Mochizuki
沸腾传热是一种利用相变潜热传递的上级传热技术。然而，由于不稳定的过渡沸腾和温度过高的薄膜沸腾难以控制，因此很难作为电子冷却技术应用。在过冷沸腾过程中，在过渡沸腾开始阶段，受热面上形成的聚结气泡破裂成许多细小气泡，且热流密度超过临界热流密度。这种沸腾状态被称为微泡排放沸腾（MEB）。介绍了两种用于电力电子器件的过冷流动沸腾MEB冷却装置，最大热流密度为500 W/cm 2（5 MW/m2）。
Boiling heat transfer is a superior heat transfer technology using the latent heat transport with phase-change. However, it has been difficult to employ as a cooling technology for electronics because the unstable transition boiling and film boiling with excessive high temperature are impossible to control. In highly subcooled boiling, the coalescing bubbles formed on the heating surface collapse to many fine bubbles at the beginning of transition boiling and the heat flux exceeds the critical heat flux. This boiling regime has been called Microbubble Emission Boiling (MEB). Two models of cooling device are introduced using subcooled flow boiling with MEB for power electronics, where the maximum heat flux is 500 W/cm 2 (5 MW/m 2 ).