Fracture behaviors and mechanism of 2D C/SiC-BCx composite under tensile load

Fracture behaviors and mechanism of 2D C/SiC-BCx composite under tensile load
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DOI:
10.1016/j.msea.2011.09.089
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发表时间:
2011-12
影响因子:
6.4
通讯作者:
Weihua Zhang;Lai-fei Cheng;Yongsheng Liu;Litong Zhang;Wenbin Yang;Shengtian Zhou
Weihua Zhang;Lai-fei Cheng;Yongsheng Liu;Litong Zhang;Wenbin Yang;Shengtian Zhou
中科院分区:
材料科学1区
文献类型:
--
作者:
Weihua Zhang;Lai-fei Cheng;Yongsheng Liu;Litong Zhang;Wenbin Yang;Shengtian Zhou

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研究了2DC/SiC-BCx复合材料的拉伸断裂行为和断裂机制。结果表明,在室温下,在相同的单调拉伸应力条件下,2DC/SiC-BCx复合材料的拉伸强度与2DC/SiC复合材料相近(约250 MPa),但断裂模式和损伤演化规律与2DC/SiC复合材料不同。在室温拉伸循环载荷下,2DC/SiC-BCx复合材料的初始模量和断裂模量分别为98.6GPa和54.5GPa。在高温下,拉伸强度低于室温下的拉伸强度,并表现为台阶状的应力-应变曲线。
Tensile fracture behaviors and mechanisms of 2D C/SiC-BCxcomposite were investigated. Results showed that the 2D C/SiC-BCxcomposite exhibited similar tensile strength (about 250MPa), but different fracture mode and damage evolution compared to that of 2D C/SiC composite under similar monotonic tensile stress condition at room temperature. The initial modulus and fracture modulus of 2D C/SiC-BCxcomposite obtained under tensile cyclic loading at RT were about 98.6GPa and 54.5GPa, respectively. At high temperatures, the tensile strengths were lower than that at room temperature and behaved as a step-like stress–strain curve.