Limitations to and solutions for optical loss in optical backplanes
Limitations to and solutions for optical loss in optical backplanes
复制标题
光背板光损耗的局限性及解决方案
DOI：
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发表时间：
2006
影响因子：
4.7
通讯作者：
M. Robertsson
中科院分区：
文献类型：
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作者：
S. Uhlig;M. Robertsson
本文从光学损耗的角度，综述了近年来关于光学、电气和混合溶液高速背板以及适用于印刷电路板（pcb）的聚合物波导系统的讨论。对背板上实际高速光聚合物波导链路的光功率预算的重新评估表明，信号放大是增强信号所必需的，这导致了对基于硅工作台技术的光放大器进展的额外文献综述。最后，对基于平面光波导放大器和半导体光放大器的有源光波导放大器件进行了概念研究。放大器件可以倒装在背板上，以补偿由于信号路由造成的光损耗，这增加了背板高密度互连上波导路由的总体自由度。混合概念设计保证了与PCB行业工艺的兼容性。
In this paper, recent literature on the discussion on high-speed backplanes with optical, electrical, and mixed solutions, as well as on polymer-waveguide systems suitable for implementation on printed circuit boards (PCBs), is reviewed from the point of view of their optical losses. The reevaluation of the optical power budget for realistic high-speed optical polymer-waveguide links on backplanes showed that signal amplification is necessary to boost the signal, which resulted in an additional literature review on advances in optical amplifiers based on silicon bench technology available. Finally, a concept study of an active optical waveguide amplifier device, based on planar optical waveguide amplifiers and semiconductor optical amplifiers, was performed. The amplification device can be flip-chip mounted on the backplane to compensate for optical losses due to signal routing, which increases the overall degree of freedom in waveguide routing on high-density interconnects for backplanes. The hybrid concept design guarantees compatibility with the processes of the PCB industry.