Microstructure and mechanical properties of Cu-Ni-Si alloys
Microstructure and mechanical properties of Cu-Ni-Si alloys
复制标题
DOI：
10.1016/j.msea.2006.12.163
复制
发表时间：
2008-06-15
期刊：
影响因子：
6.4
通讯作者：
Watanabe, Chihiro
中科院分区：
文献类型：
--
作者：
Monzen, Ryoichi;Watanabe, Chihiro
研究了含镁0.1wt.%和不含镁2.0wt.%Ni-0.5wt.%Si合金在400℃时效后的组织和力学性能。镁的加入促进了盘状Ni(2)Si析出物的形成。与铜镍硅合金相比，铜镍硅镁合金具有更高的强度和抗应力松弛能力。较高的强度或应力松弛抗力是由于镁的加入或镁原子对位错运动的拖曳作用而减小了析出相间的间距。大晶粒度为150µm的Cu-Ni-Si合金具有比小晶粒度为10µm的合金更高的抗应力松弛能力，这是因为前者中的可移动位错密度较低。(C)2007 Elsevier B.V.保留所有权利。
The microstructure and mechanical properties of 0.1 wt.% Mg-added and Mg-free Cu-2.0 wt.% Ni-0.5 wt.% Si alloys aged at 400 degrees C have been examined. The addition of Mg promotes the formation of disk-shaped Ni(2)Si precipitates. The Cu-Ni-Si-Mg alloy exhibits higher strength and resistance to stress relaxation than the Cu-Ni-Si alloy. The higher strength or stress relaxation resistance is attributable to the reduction in inter-precipitate spacing by the Mg addition or the drag effect of Mg atoms on dislocation motion. The Cu-Ni-Si alloy with a large grain size of 150 mu m shows higher stress relaxation resistance than the alloy with a small grain size of 10 mu m because of a lower density of mobile dislocations in the former alloy. (c) 2007 Elsevier B.V. All rights reserved.