Atomic Force Microscope Characterization of the Bending Stiffness and Surface Topography of Silicon and Polymeric Electrodes.

Atomic Force Microscope Characterization of the Bending Stiffness and Surface Topography of Silicon and Polymeric Electrodes.
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硅和聚合物电极的弯曲刚度和表面形貌的原子力显微镜表征。

DOI:
10.1109/embc48229.2022.9871216
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发表时间:
2022
期刊:
Annual International Conference of the IEEE Engineering in Medicine and Biology Society. IEEE Engineering in Medicine and Biology Society. Annual International Conference
影响因子:
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通讯作者:
Purcell,ErinK
Purcell,ErinK
中科院分区:
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文献类型:
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作者:
Riggins,Ti'AirE;Li,Wen;Purcell,ErinK

文献摘要

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在大脑中植入电极越来越多地用于研究和临床环境,以了解和治疗神经系统疾病。然而,异物反应通常发生在植入后,并且通常观察到器械的神经胶质包囊。多种因素影响植入式电极周围的神经胶质增生的演变。表征和测量这些设备的表面特征和机械特性可以让我们预测神经胶质增生将发生在哪里,并且了解电极设计特征如何影响星形胶质增生可以为研究人员提供一套设计指南,以最大限度地提高慢性性能。在这项研究中,我们使用原子力显微镜来测量对二甲苯,聚酰亚胺和硅器件的表面粗糙度。测量微电极阵列上的多个特征,包括电极位点、迹线和体衬底。我们发现不同器械材料的表面粗糙度存在差异,但器械特征无差异。我们还直接测量了硅器件的弯曲刚度,提供了更准确的量化这一属性,以证实计算的估计。
Implanted electrodes in the brain are increasingly used in research and clinical settings to understand and treat neurological conditions. However, a foreign body response typically occurs after implantation, and glial encapsulation of the device is a commonly observed. Multiple factors affect how gliosis surrounding the implantable electrodes evolves. Characterizing and measuring the surface features and mechanical properties of these devices may allow us to predict where gliosis will occur, and understanding how electrode design features may impact astrogliosis may give researchers a set of design guidelines to follow to maximize chronic performance. In this study, we used atomic force microscopy to measure surface roughness on parylene, polyimide, and silicon devices. Multiple features on microelectrode arrays were measured, including electrode sites, traces, and the bulk substrate. We found differences in surface roughness according to device material, but not device features. We also directly measured the bending stiffness of silicon devices, providing a more exact quantification of this property to corroborate calculated estimates.