Interface Fatigue Crack Propagation in Ceramic Thermal Barrier Coatings

Interface Fatigue Crack Propagation in Ceramic Thermal Barrier Coatings
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陶瓷热障涂层中的界面疲劳裂纹扩展

DOI:
10.1299/jsmea.46.403
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发表时间:
2003
期刊:
Jsme International Journal Series A-solid Mechanics and Material Engineering
影响因子:
--
通讯作者:
Masashi Takahashi
Masashi Takahashi
中科院分区:
--
文献类型:
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作者:
Y. Mutoh;Jin;Y. Miyashita;G. G. Bernardo;Masashi Takahashi

文献摘要

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热障涂层的失效,尤其是陶瓷涂层的剥落,不仅会导致热障性能的下降,而且会对涡轮机部件造成严重的损伤。陶瓷涂层的剥落将伴随着裂纹的萌生和沿着陶瓷表层与金属结合层的界面扩展。在本研究中,在室温和高温下进行了不同孔隙率的热障涂层的疲劳裂纹扩展试验。结果表明,在复合型条件下,界面裂纹在缺口附近沿着界面扩展,其扩展行为可用ΔK参数表征。= K12 + K22,对应于能量释放率。随着陶瓷涂层孔隙率的增加,裂纹扩展阻力降低。高温下的裂纹扩展阻力比室温下的低。
Failure of thermal barrier coating (TBC) layer, especially spalling of ceramic coating layer, results not only in degradation of thermal barrier properties but also in crucial damage to turbine components. The spalling of ceramic coating layer will follow the crack initiation and propagation along the interface between ceramic top-layer and metal bond-layer. In the present study, fatigue crack growth tests of TBCs with various porosities were carried out at room and elevated temperatures. It is found that an interface crack induced near a pre-introduced notch propagates along the interface under mixed mode condition, and its growth behavior can be well characterized by using the parameter ΔK. = K 1 2 + K 2 2, which corresponds to the energy release rate. It is also found that the crack propagation resistance decreases with increasing of the porosity of the top ceramic coating. The crack propagation resistance at elevated temperature becomes lower compared to that at room temperature.