Effects of bimodal size SiC particles on the microstructure evolution and fracture mechanism of AZ91 matrix at room temperature

Effects of bimodal size SiC particles on the microstructure evolution and fracture mechanism of AZ91 matrix at room temperature
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双峰尺寸SiC颗粒对AZ91基体室温微观组织演变和断裂机制的影响

DOI:
10.1016/j.msea.2012.05.094
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发表时间:
2012-09
影响因子:
6.4
通讯作者:
Wu, Kun
Wu, Kun
中科院分区:
材料科学1区
文献类型:
--
作者:
Wang, Cui-ju;Shi, Ju-yan;Hu, Xiao-shi;Wu, Kun

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采用搅拌铸造法制备了(0.2μ m1%+10μ m9%)双峰尺寸SiCp/AZ 91镁基复合材料。在420°C下以50%的压下量锻造之后,复合材料在370°C下以16的比例进行挤压。利用透射电镜研究了双峰尺寸SiCp/AZ 91复合材料在室温拉伸过程中的组织演变。结果表明,位错在双峰尺寸颗粒周围堆积,而孪晶则在远离微米尺寸颗粒处形成。与亚微米颗粒相比,微米颗粒的端部容易产生较大的应力集中,从而导致微裂纹的出现。而亚微米SiCp与镁基体之间的界面结合良好,在亚微米颗粒周围没有发现微裂纹。认为亚微米SiCp的存在有利于阻止微裂纹的扩展,从而有助于镁合金强度的提高。
In this paper, (0.2μm 1%+10μm 9%) bimodal size SiCp/AZ91 magnesium matrix composite was fabricated by the stir casting. After being forged at 420°C with 50% reduction, the composite was subjected to extrusion at 370°C with the ratio of 16. Microstructure evolution of bimodal size SiCp/AZ91 composite during room temperature tensile process was investigated using transmission electron microscopy. Results illustrate that the dislocations pile up around bimodal size particles while the twinning is formed away from micron particles. Compared with submicron particles, larger stress concentration is occurred easily at the end of micron particles, thus results in the appearance of microcracks. However, the interface bonding between submicron SiCp and magnesium matrix is very well, and no microcracks are found around submicron particles. It is thought that the existence of submicron SiCp is propitious to hinder the propagation of microcracks, which contributes to the increased strength of magnesium.
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