Enhanced boiling performance of a nanoporous copper surface by electrodeposition and heat treatment
Enhanced boiling performance of a nanoporous copper surface by electrodeposition and heat treatment
复制标题
通过电沉积和热处理增强纳米多孔铜表面的沸腾性能
DOI：
10.1007/s00231-016-1868-4
复制
发表时间：
2017-03-01
影响因子：
2.2
通讯作者：
Tang, Biao
中科院分区：
文献类型：
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作者：
Gao, Jiao;Lu, Long-Sheng;Tang, Biao
采用电沉积和热处理复合技术在铜块表面制备了纳米孔结构。分析了热处理参数对结构结合力的影响，搭建了测试池沸腾换热性能的平台。通过观察SEM形貌，确定了电沉积参数对纳米孔结构形成的影响，并比较了不同表面之间的传热系数和壁面过热度。同时，采用可视化的方法，研究了光滑表面和纳米孔表面在不同热通量下的气泡行为。结果表明，经电沉积和热处理制备的纳米多孔铜表面结构可使结合强度提高77%，壁面过热度降低45%，传热系数提高80%。
A nanoporous structure was fabricated on the surface of a copper block by electrodeposition and heat treatment compound technology. The influence of the heat treatment parameters on the binding force of a structure was analyzed, and a platform was set up to test the pool boiling heat transfer performance. By observing the SEM morphology, the effect of electrodeposition parameters on the formation of nanoporous structure was determined, and the heat transfer coefficient and wall superheat between different surfaces were compared. At the same time, by means of visualization, the bubble behavior of a smooth surface and a nanoporous surface under different heat fluxes was studied. The results show that the surface structure of nanoporous copper prepared by electrodeposition and heat treatment can improve the bonding strength by 77 %, decrease the wall superheat by 45 %, and increase the heat transfer coefficient by 80 %.