Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Coupled Data Communication Techniques for High-Performance and Low-Power Computing
复制标题
高性能低功耗计算的耦合数据通信技术
DOI：
--
复制
发表时间：
2010
期刊：
影响因子：
--
通讯作者：
R. Drost
中科院分区：
文献类型：
--
作者：
R. Ho;R. Drost
本书概述了耦合数据技术的电路、体系结构和芯片封装。讨论了芯片到板的电容耦合、芯片到芯片的电容耦合、芯片到芯片的电感耦合和芯片到芯片的光学耦合的研究现状。深入探讨了电路、建模及其对封装的影响。讨论了确保芯片精确和持续对准的机械方法，以及补偿由此产生的未对准的电气方法。最后，这本书涵盖了面向制造和测试的设计所提出的问题。这本书是一个新兴领域的第一本书。耦合数据通信提供了看待片外I/O受限这一老问题的新方法：它在I/O性能上权衡了封装的复杂性；它为3D或堆叠芯片体系结构提供了一套使能技术；它提高了MCM中可替换芯片的可能性--从而提高了产量。
This book provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. It discusses thecurrent research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling. Circuits, modeling, and their implications for packagingare explored in depth. Mechanical methods to ensure accurate and sustained chip alignmentare discussed, as well as electrical methods to compensate for resulting misalignment. Finally, the book covers issues raised by design for manufacturing and test. This book isone of the first in a new and emerging area. Coupled data communication offers new ways of looking at the old problem of limited off-chip I/O: it trades off packaging complexity for I/O performance; it offers a set of enabling technologies for 3D or stacked-chip architectures; and it raises the possibility of replace-able chips--and thus high yield--in an MCM.