Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions
Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions
复制标题
DOI：
10.1016/j.actamat.2017.02.067
复制
发表时间：
2017-05-01
期刊：
影响因子：
9.4
通讯作者：
Kirchlechner, C.
中科院分区：
文献类型：
--
作者：
Malyar, N. V.;Micha, J. -S.;Kirchlechner, C.
采用原位劳厄微衍射（mu Laue）压缩方法研究了几种5 × 5 μ m尺寸的Cu双晶的力学行为，目的是揭示通过孪晶界面的滑移传递机制。另外测试单晶柱（SCP）并用作参考样品。工程应力-应变曲线和事后扫描电子显微镜（SEM）图像进行了相关的TB角的局部演变，存储的几何必要的位错和晶体取向的原位X-射线劳厄微衍射（μ劳厄）调查。无论是mu劳厄和尸检SEM证明多个传输事件通过TB没有显着存储的几何必要的位错在晶体中或在边界上，独立于压缩方向。然而，在工程应变大于5%的一个小的位错堆积曾经观察到暂时的边界。根据目前的实验结果，讨论了传输应力的上限和下限。(C)2017 Acta Materialia Inc.由爱思唯尔有限公司出版。保留所有权利。
The mechanical behavior of several 5 x 5 micron sized Cu bi-crystals with a single coherent Sigma 3{111} twin boundary (TB) is studied by in situ Laue microdiffraction (mu Laue) compression with the aim to unravel the slip transfer mechanisms through TBs. Single crystalline pillars (SCP) are additionally tested and used as reference samples. Engineering stress-strain curves and post mortem scanning electron microscopy (SEM) images were correlated to the local evolution of the TB angle, the storage of geometrically necessary dislocations and crystal orientations investigated by in situ X-ray Laue micro diffraction (mu Laue). Both mu Laue and post mortem SEM demonstrate multiple transmission events through the TB without significant storage of geometrically necessary dislocations in the crystals or at the boundary, independent on the compression direction. Nevertheless, at engineering strains larger than 5% a small dislocation pile-up was once observed temporarily at the boundary. Upper and lower bounds for the transmission stress are discussed based on the current experimental results. (C) 2017 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.