A 5.5Gb/s 5mm contactless interface containing a 50Mb/s bidirectional sub-channel employing common-mode OOK signaling
A 5.5Gb/s 5mm contactless interface containing a 50Mb/s bidirectional sub-channel employing common-mode OOK signaling
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5.5Gb/s 5mm 非接触式接口，包含采用共模 OOK 信令的 50Mb/s 双向子通道
DOI：
10.1109/isscc.2013.6487790
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发表时间：
2013
期刊：
影响因子：
--
通讯作者：
M. Mizuno
中科院分区：
文献类型：
--
作者：
K. Hijioka;M. Matsudaira;Koichi Yamaguchi;M. Mizuno
模块之间的大容量、毫米范围、非接触式接口将取代现有的使用线束和连接器的接口，预计将在许多应用中采用，因为它们将提供诸如对由于振动/摩擦引起的机械故障的免疫力、与水/化学品的隔离以及较低的制造成本等特征。与有线通信相比，已经被优化用于在大于1cm的距离处通信的诸如UWB或mm波的常规无线电波技术将遭受功率性能的低效率。本文介绍了近距离通信使用的耦合器封装，提供了一个模块之间的宽带通道。我们的耦合器封装中相对较大的耦合器尺寸允许通信距离为1cm或更小，而用于堆叠芯片[1，2]之间通信的传统技术的通信距离小于数百μm。宽带信道使芯片之间的基带通信，以支持Gb/s范围的数据传输与传统的有线收发器的功率效率相当。
High-volume, mm-range, contact-less interfaces between modules, which would replace existing interfaces that use wire harnesses and connectors, are expected to be employed in many applications because they would provide such features as immunity to mechanical failures due to vibration/friction, isolation from water/chemicals, and lower fabrication costs. Such conventional radio-wave techniques as UWBs or mm-waves that have been optimized for communication at distances greater than 1cm would suffer from inefficiency in power performance compared with wireline communications. This paper introduces proximity communication using a coupler-in-package that provides a wide-band channel between modules. The relatively large coupler-size in our coupler-in-package permits communication distances to be 1cm or less, while conventional techniques for communication between stacked chips [1,2] have communication distances of less than hundreds of μm. The wideband channel enables baseband communication between chips to support Gb/s-range data transfer with power efficiency comparable to that of conventional wireline transceivers.