Improvement of Thermoelectric Performance for Sb-Doped SnO2 Ceramics Material by Addition of Cu as Sintering Additive
Improvement of Thermoelectric Performance for Sb-Doped SnO2 Ceramics Material by Addition of Cu as Sintering Additive
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DOI：
10.1007/s11664-014-3227-x
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发表时间：
2014-05
影响因子：
2.1
通讯作者：
Toshiki Tsubota;Shogo Kobayashi;N. Murakami;T. Ohno
中科院分区：
文献类型：
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作者：
Toshiki Tsubota;Shogo Kobayashi;N. Murakami;T. Ohno
详细研究了Sb和Cu掺杂的SnO 2（即（Sn 1 −x−yCuxSby）O2）的热电性能，如塞贝克系数值S、电导率σ和热导率κ。少量CuO的加入显著提高了SnO 2陶瓷的相对密度。但CuO的过量添加（x> 0.03）使材料的相对密度略有下降。Sb_2O_5的加入应引起载流子数的增加，从而导致σ值的增加，CuO和Sb_2O_5的加入均引起σ值的增加，|S|在高温下。烧结性能的改善导致热电性能的提高。作为本研究中测量的温度区域（293-1073 K），对于（Sn0.985Cu0.005Sb0.01）O2，最大ZT值在1073 K处为0.29。
The thermoelectric properties, such as the Seebeck coefficient value,S, electrical conductivity,σ, and thermal conductivity,κ, of Sb- and Cu-doped SnO2, that is, (Sn1−x−yCuxSby)O2, were investigated in detail. The addition of a small amount of CuO significantly improved the relative density of the SnO2ceramics. However, the relative density slightly decreased with the excessive addition of CuO (more thanx= 0.03). The addition of Sb2O5should cause an increase in the number of charge carriers, resulting in an increasedσvalue, and the addition of both CuO and Sb2O5caused an increase inσand |S| at high temperature. The improvement of the sintering performance caused the enhancement of the thermoelectric performance. As the temperature region measured in this study (293–1073 K), the maximumZTvalue was 0.29 at 1073 K for (Sn0.985Cu0.005Sb0.01)O2.