Simultaneously improved thermal conductivity and mechanical properties of boron nitride nanosheets/aramid nanofiber films by constructing multilayer gradient structure

Simultaneously improved thermal conductivity and mechanical properties of boron nitride nanosheets/aramid nanofiber films by constructing multilayer gradient structure
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DOI:
10.1016/j.compositesb.2021.109454
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发表时间:
2021-11
期刊:
Composites Part B: Engineering
影响因子:
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通讯作者:
Lihua Zhao;Lei Wang;Yi-Fei Jin;Junwen Ren;Zhong Wang;Liya Jia
Lihua Zhao;Lei Wang;Yi-Fei Jin;Junwen Ren;Zhong Wang;Liya Jia
中科院分区:
其他
文献类型:
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作者:
Lihua Zhao;Lei Wang;Yi-Fei Jin;Junwen Ren;Zhong Wang;Liya Jia

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导热聚合物复合材料(TCPC)在电子设备和现代电气系统中的热管理中是高度期望的。然而,如何协调TCPCs的导热性能和力学性能之间的矛盾仍然是一个巨大的挑战。在此,我们实现了多层梯度氮化硼纳米片/芳纶纤维(BNNS/ANF)薄膜具有优异的导热性和改善的拉伸强度的发展。BNNS/ANF多层梯度膜的面内热导率为19.13 W/(m K),拉伸强度为59.3 MPa,比相同BNNS含量的单层BNNS/ANF膜分别提高了23.6%和61.6%,具有上级优越性。通过有限元分析,阐明了多层梯度结构对导热系数和拉伸强度的增强机理。这些理想的性能表明,多层梯度结构是一种有效的策略,以解决热导率和机械性能之间的冲突,并铺平了道路,为热管理应用的高性能TCPC的设计和制备。
Thermally conductive polymer composites (TCPCs) are highly desirable for thermal management in electronic devices and modern electrical systems. However, it still remains a great challenge to reconciliate the conflict between thermal conductivity and mechanical properties of TCPCs. Herein, we realized the development of multilayer gradient boron nitride nanosheet/aramid nanofiber (BNNS/ANF) films with excellent thermal conductivity and improved tensile strength. The multilayer gradient BNNS/ANF films achieved a superior in-plane thermal conductivity of 19.13 W/(m K) and a high tensile strength of 59.3 MPa, with 23.6% and 61.6% increases compared to the single-layer BNNS/ANF film at the same BNNS content. Finite element analysis was used to clarify the enhanced mechanism of the multilayer gradient structure on thermal conductivity and tensile strength. These desirable properties demonstrate that the multilayer gradient structure is an efficient strategy to address the conflict between thermal conductivity and mechanical properties, and paves the way for the design and preparation of high-performance TCPCs for thermal management applications.