Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems
Silicon interconnect fabric: A versatile heterogeneous integration platform for AI systems
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硅互连结构：用于人工智能系统的多功能异构集成平台
DOI：
10.1147/jrd.2019.2940427
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发表时间：
2019
期刊：
影响因子：
--
通讯作者：
Boris Vaisband
中科院分区：
文献类型：
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作者：
S. Iyer;SivaChandra Jangam;Boris Vaisband
介绍了硅互连结构（Si-IF）作为一种集成高性能扩展系统（包括人工智能系统）的平台。Si-IF是一个晶圆级平台，能够以细间距（2-10 µm）和小芯片间距（≤100 µm）集成裸芯片，可与片上连接相媲美。讨论了在硅IF上集成所需的材料、芯片尺寸和间距的选择。文中详细介绍了硅中频芯片的组装过程、电气和机械实验结果以及保证系统可靠性的方法。本文还介绍了用于通信、功率传输和热提取的其他系统级方法，以支持Si-IF平台上的异构超大型系统。
The silicon interconnect fabric (Si-IF) as a platform for integration of high performance scaled out systems including artificial intelligence systems is introduced in this article. The Si-IF is a wafer-sized platform that enables integration of bare dies at fine pitch (2–10 µm) and small inter-die spacing (≤100 µm) comparable to on-die connectivity. The choice of materials, die size, and pitch for integration on the Si-IF is discussed. The assembly process of dies on the Si-IF, electrical and mechanical experimental results, and an approach to ensure reliability of the system are described in detail. Additional system-level methodologies for communication, power delivery, and heat extraction to support heterogeneous ultralarge systems on the Si-IF platform are presented.