Thermal and mechanical properties of copper-graphite and copper-reduced graphene oxide composites
Thermal and mechanical properties of copper-graphite and copper-reduced graphene oxide composites
复制标题
铜-石墨和铜还原氧化石墨烯复合材料的热性能和机械性能
DOI：
10.1016/j.compositesb.2018.11.004
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发表时间：
2019-04-15
影响因子：
13.1
通讯作者：
Malik, Abdul
中科院分区：
文献类型：
--
作者：
Nazeer, Faisal;Ma, Zhuang;Malik, Abdul
石墨烯及其衍生物具有较高的导热系数和良好的机械性能。很少有研究关注各向异性导热系数，而还原氧化石墨烯/金属的各向异性导热系数和硬度仍远远落后于预期值。在这项工作中，采用不同目数的石墨和氧化石墨烯，通过粉末冶金技术制备铜-石墨和铜还原氧化石墨烯复合材料。通过拉曼、XRD、XPS 和 SEM 来评估复合材料以及合成的氧化石墨烯的无序、物相分析、表面形貌和微观结构演变。对复合材料的各向异性导热系数和维氏硬度进行了表征，以检查不同网格尺寸对铜-石墨和铜还原氧化石墨烯复合材料的影响。结果表明，仅1 wt%氧化石墨烯网格尺寸为3500 μm的铜还原氧化石墨烯复合材料就获得了比纯铜高80%和61%的各向异性热导率面内和贯通面比（1.68）和硬度（71.2 HV）。此外，与网目尺寸500μm和1000μm相比，石墨和氧化石墨烯网目尺寸(3500μm)给出了良好的结果。良好的各向异性导热性和高硬度表明它可能是热封装中理想的散热器材料。
Graphene and its derivatives have a high value of thermal conductivity and good mechanical properties. Rare studies focused on the anisotropic thermal conductivity, while anisotropic thermal conductivity and hardness of reduced graphene oxide/metal are still far behind the expected values. In this work, different mesh sizes of graphite and graphene oxide were used for making copper-graphite and copper-reduced graphene oxide composites with the powder metallurgy technique. Raman, XRD, XPS and SEM were performed to evaluate the disorder, phase analysis, surface morphology and microstructure evolution of the composites as well as synthesized graphene oxide. Anisotropic thermal conductivity and Vickers hardness of the composites were characterized to check the effects of different mesh size on copper-graphite and copper-reduced graphene oxide composite. Results show that anisotropic thermal conductivity in-plane and through-plane ratio (1.68) and hardness (71.2 HV) which is 80% and 61% greater than pure copper were attained at only 1 wt% graphene oxide mesh size 3500 mu m copper-reduced graphene oxide composite. Moreover, graphite and graphene oxide mesh size (3500 mu m) gave good results compared with mesh sizes 500 mu m and 1000 mu m. The good anisotropic thermal conductivity and high hardness suggest that it may be ideal materials as heat sinks in thermal packaging.