Measurements of Film-Substrate Bond Strength by Laser Spallation
Measurements of Film-Substrate Bond Strength by Laser Spallation
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通过激光散裂测量薄膜-基材结合强度
DOI：
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发表时间：
1978
期刊：
影响因子：
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通讯作者：
J. Vossen
中科院分区：
文献类型：
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作者：
J. Vossen
激光剥离是一种通过将脉冲的高能激光束照射到基板的背面(在透明基板上使其不透明)来将薄膜从基板上分离出来的技术。吸收材料背面的爆炸性蒸发通过基片向基片-基片界面发射反冲压缩冲击波。然后，衬底在张力中突然弹回。膜剥离的阈值可以得到关于膜-基键的信息，而不与膜表面接触或干扰膜表面。从而消除了由薄膜表面扰动向界面传播的损伤。在某些情况下，可以检查[例如，通过俄歇电子能谱(AES)]剥落的点和从其剥落的衬底区域，以确定失效轨迹并获得关于界面形成的信息。
Laser spallation is a technique for detaching thin films from substrates by impinging a pulsed, high-energy laser beam onto the back side of a substrate (made opaque in the case of transparent substrates). The explosive evaporation of absorbing material on the back side sends a recoil compressive shock wave through the substrate toward the film-substrate interface. The substrate then snaps back in tension. Threshold values for film detachment can yield information about the film-substrate bonds without contact with or disturbance of the film surface. Thus damage propagated to the interface from film surface disturbance is eliminated. In some cases it is possible to examine [for example, by Auger electron spectroscopy (AES)] the spalled dot and the region of the substrate from which it was spalled to determine the locus of failure and to obtain information about interface formation.