Multiclass moisture classification in woodchips using IIoT Wi-Fi and machine learning techniques
Multiclass moisture classification in woodchips using IIoT Wi-Fi and machine learning techniques
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DOI:
10.1016/j.compchemeng.2021.107445
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发表时间:
2021-07-31
影响因子:
4.3
通讯作者:
He, Q. Peter
中科院分区:
文献类型:
--
作者:
Suthar, Kerul;He, Q. Peter
For the pulping process in a pulp & paper plant that uses woodchips as raw material, the moisture content (MC) of the woodchips is a major process disturbance that affects product quality and con-sumption of energy, water and chemicals. Existing woodchip MC sensing technologies have not been widely adopted by the industry due to unreliable performance and/or high maintenance requirements that can hardly be met in a manufacturing environment. To address these limitations, we propose a non-destructive, economic, and robust woodchip MC sensing approach utilizing channel state information (CSI) from industrial Internet-of-Things (IIoT) based Wi-Fi. While these IIoT devices are small, low-cost, and rugged to stand for harsh environment, they do have their limitations such as the raw CSI data are often very noisy and sensitive to woodchip packing. To address this, statistics pattern analysis (SPA) is utilized to extract physically and/or statistically meaningful features from the raw CSI data, which are sensitive to woodchip MC but not to packing. The SPA features are then used for developing multiclass classification models using various linear and nonlinear machine learning techniques to provide poten-tial solutions to woodchip MC estimation for the pulp and paper industry. This work also demonstrates that classification accuracy alone is not a good performance metric for industrial applications, and the practical implications of misclassification must also be considered. (c) 2021 Elsevier Ltd. All rights reserved.