Bond tool life improvement for large copper wire bonding
Bond tool life improvement for large copper wire bonding
复制标题
提高大型铜线键合的键合工具寿命
DOI：
10.1109/eptc.2015.7412381
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发表时间：
2015
期刊：
影响因子：
--
通讯作者：
C. Luechinger
中科院分区：
文献类型：
--
作者：
Tao Xu;Todd Walker;Raymond P. S. Chen;Jason Fu;C. Luechinger
铝（Al）线互连不能满足电力电子中增加的需求。铜（Cu）线互连被引入高功率、高温应用中。Cu线是硬得多的材料，并且比Al线更快地磨损焊接工具。提高焊接工具寿命和保持工艺稳定性是铜线互连进入大规模生产之前必须满足的挑战。结合工具的磨损机理进行了研究，并提出了潜在的解决方案和验证。通过减小焊接工具凹槽深度，焊接工具的尖端进一步远离基板，并且焊接工具可以在工具磨损和废弃之前进行更多的焊接。通过优化焊接工艺，标准焊接工具与铜线的相互作用方式不同，焊接工具的使用寿命延长了一倍。研制了一种高耦合的焊接工具，以减少焊接工具与铜线之间的相对运动，减少焊接工具的磨损，从而延长工具的使用寿命，减少铜屑。通过结合焊接工具尖端几何形状设计和焊接工艺优化，可以显著延长焊接工具寿命。
The aluminum (Al) wire interconnect cannot fulfill the increased demand in power electronics. The Copper (Cu) wire interconnect is being introduced in high power, high temperature applications. The Cu wire is much harder material and wears the bond tool much faster than the Al wire. Improving the bond tool life and maintaining the process stability are challenges that must be met before the Cu wire interconnect will go to mass production. The bond tool wear mechanism is investigated and potential solutions are proposed and validated. By reducing bond tool groove depth, the tip of bond tool is further away from substrates and the bond tool can make more bonds before the tool is worn out and discarded. By optimizing the bond process, a standard bond tool interacts differently with Cu wire and the bond tool life is doubled. A high coupling bond tool is developed to reduce the relative motion between the bond tool and Cu wire and decrease the bond tool wear, making a longer tool life and fewer Cu flakes. By combining bond tool tip geometry design and bond process optimization, the bond tool life can be significantly extended.